According to South Korean media The Elec, Apple has recently requested Samsung to start researching a new packaging method for Low Power Double Data Rate (LPDDR) DRAM in order to further enhance the edge AI performance of the iPhone. This requirement marks Apple's continued efforts to enhance the AI capabilities of its devices. Currently, Apple's iPhone uses a Package on Package (PoP) solution, stacking LPDDR DRAM directly on top of the System on Chip (SoC), a design that has been in use since 2010.